工艺整合工程师岗位职责3篇

第1篇 半导体工艺整合工程师岗位职责

岗位职责:1.射频半导体工艺持续改进:性能提升、良率提升;2.半导体工艺相关的失效分析及解决方案验证。任职要求:1.深厚的半导体材料、器件、工艺背景知识。2.有cmossoi工艺或gaasinpgan工艺的开发工作经验,熟悉半导体生产各道工艺的流程和运作机理。3.深刻理解fethbtphemt等器件的工作机理,具有失效分析、器件性能改进和良率提升的能力。4.了解半导体工厂的运行流程,具有较强的向外沟通和组织能力。

第2篇 工艺整合工程师岗位职责任职要求

工艺整合工程师岗位职责

职责描述:

1. 负责40/28nm cmos逻辑、mram器件性能分析和优化;

2. 负责40/28nm cmos逻辑，mram器件的可靠性问题分析，包括对失效模型的分析，并给出解决方案;

3. 与代工厂协同工作，设计40/28nm cmos、mram有关的testkey，并对器件进行失效分析;

任职要求:

1.微电子及相关专业硕士以上学历;

2.五年以上半导体器件开发经验，精通cmos器件性能与可靠性优化和测试;(有存储芯片研发经验者优先)

3.熟练掌握半导体芯片开发流程和方法;

4.有sram或嵌入式nvm经验及与代工厂合作经验者优先;

5.具有良好的工作协调能力，沟通能力和团队精神。良好的文档编辑与处理能力。

工艺整合工程师岗位

第3篇 工艺整合工程师岗位职责

工艺整合工程师 job description:

new technology development and new products ramp-up in fab. mass production yield maintenance and continuous improvement. interfaces with business units, atd, process modules, quality, manufacturing, a/t sites for problem solving, cost reduction, productivity and process robustness.

basic qualifications:

-2019 bachelor degree or above; microelectronics/electronics/material/chemistry/physics or equivalent;

-candidates with semiconductor wafer fabrication e_perience are preferred;

-good ownership and accountability;

-good team player;

-fluent in english--written and verbal. job description:

new technology development and new products ramp-up in fab. mass production yield maintenance and continuous improvement. interfaces with business units, atd, process modules, quality, manufacturing, a/t sites for problem solving, cost reduction, productivity and process robustness.

basic qualifications:

-2019 bachelor degree or above; microelectronics/electronics/material/chemistry/physics or equivalent;

-candidates with semiconductor wafer fabrication e_perience are preferred;

-good ownership and accountability;

-good team player;

-fluent in english--written and verbal.